SCIENTIFIC DOMAINS

Photon science

Key words: Fundamental Physics, Nanotechnology, Micro- and Nanoelectronics, Advanced Materials, Metrology and Standardization

– Micro- and nanoelectronics: Development and testing of equipment for X‑ray lithography, creation of new types of integrated circuits (including elements with critical dimensions down to 1 nm) and microwave devices.

– Advanced materials: Investigation of the structure and properties of new materials at the atomic level for their application in electronics, energy, and other industries.

– Metrology and standardization: Providing accurate measurements and creating standards for high‑tech industries.

SCIENTIFIC GOALS

– A platform to catalyze a technological breakthrough and achieve global competitiveness in microelectronics and lithography

– Conducting cutting-edge research for creation of new materials.

– Create a reference base for high-tech industries.

– Provide new industry with qualified personnel.

– Forming a center for innovations in the interests of various economic sectors.

FACILITIES

Composition of the Accelerator-Storage Complex

The layout of the TSC «Zelenograd» accelerator complex includes the following sequentially arranged elements:

– Injector (Linear accelerator): The initial element that accelerates electrons to an energy of 80 MeV. The accelerating structure, 6 m long, operates at a frequency of 2.8 GHz.

– Booster (Intermediate storage ring): A small ring (about 3 m in diameter) that further accelerates the beam from the injector to an energy of 450 MeV.

– Main storage ring (Large ring): The central element of the complex with a circumference of 115.73 m. Its diameter is about 40 m. Here, electrons are accumulated and accelerated to the operating energy of 1.2–2.2 GeV. This storage ring is the direct source of synchrotron radiation for technological and research tasks.

– Beam transport channels: A system that ensures the transfer of the electron beam between the main elements of the complex: from the linear accelerator to the booster and from the booster to the large storage ring.

Beamlines and Infrastructure

The following are used for experiments and technological processes:

– Radiation output channels: More than 30 synchrotron radiation beams are extracted from the large storage ring to connect beamlines.

– Insertion devices: To generate radiation with special properties, undulators and wigglers are placed in the straight sections of the main ring.

– Beamlines: Scientific and technological work is carried out here. The integration of analytical beamlines with technological lines for the production of integrated circuits is provided for.

– Engineering infrastructure: Includes buildings and tunnels for housing the complex, power supply systems, automated radiation monitoring, data collection and storage, as well as accelerator control and life support systems.

CHALLENGES

– Setup of pilot technological processes for ultra‑high resolution EUV lithography on semiconductor wafers.

– Investigation of resist functional properties, patterning of test structures at the operating wavelength, determination of ultimate resolution.

– Study of new advanced materials for microelectronics using methods: photoelectron spectroscopy, X‑ray absorption spectroscopy for chemical reaction analysis, investigation of resist dopant behaviour.

– Measurement of EUV mask optical coating reflectance;

– Investigation of defects in EUV masks.

PARTNERSHIP PROPOSAL

Russian government